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| EUROSEMI NEWSLETTER - PLAIN TEXT VERSION                |
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| http://www.eurosemi.eu.com                              |
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| 22nd June 2005
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| Contents                                                |
| ~~~~~~~~~                                               |
| - SECAP ends with working 300mm line
| - CEA Leti announces low power transistors for 45nm and beyond
| - SEMI report looks at Chinese manufacturing trends
| - Price Erosion Spurs NOR Flash Revenue Decline in 2005

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SECAP ends with working 300mm line
The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) has announced that they will disband now that the consortium has successfully established 300 mm Wafer Level Packaging as a functional technology and full-volume production on the first installed wafer-bumping line is underway.
To view the whole story goto:http://www.eurosemi.eu.com/cgi-bin/viewnew22.pl?id=6414
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CEA Leti announces low power transistors for 45nm and beyond
Just one year after the inauguration of the Nanotec 300 research platform for the 45 and 32 nanometer microelectronics nodes, CEA Leti announced the successful completion of its first High K metal gate transistors on 300mm wafers.
To view the whole story goto:http://www.eurosemi.eu.com/cgi-bin/viewnew22.pl?id=6415
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SEMI report looks at Chinese manufacturing trends
SEMI has released a report that shows the Chinese semiconductor market is increasing faster than the rest of the world with 300mm wafers already being tested well before predictions based on external restrictions placed upon the country's technological growth.
To view the whole story goto:http://www.eurosemi.eu.com/cgi-bin/viewnew22.pl?id=6416
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Price Erosion Spurs NOR Flash Revenue Decline in 2005
Cutthroat competition is spurring continued price erosion for NOR-type flash memory, resulting in a significant decline in market revenue this year, according to iSuppli Corp.
To view the whole story goto:http://www.eurosemi.eu.com/cgi-bin/viewnew22.pl?id=6417

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